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? semiconductor components industries, llc, 2014 april, 2014 ? rev. 17 1 publication order number: mc33201/d mc33201, mc33202, mc33204, ncv33202, ncv33204 low voltage, rail-to-rail operational amplifiers the mc33201/2/4 family of operational amplifiers provide rail?to?rail operation on both the input and output. the inputs can be driven as high as 200 mv beyond the supply rails without phase reversal on the outputs, and the output can swing within 50 mv of each rail. this rail?to?rail operation enables the user to make full use of the supply voltage range available. it is designed to work at very low supply voltages ( 0.9 v) yet can operate with a supply of up to +12 v and ground. output current boosting techniques provide a high output current capability while keeping the drain current of the amplifier to a minimum. also, the combination of low noise and distortion with a high slew rate and drive capability make this an ideal amplifier for audio applications. features ? low voltage, single supply operation (+1.8 v and ground to +12 v and ground) ? input voltage range includes both supply rails ? output voltage swings within 50 mv of both rails ? no phase reversal on the output for over?driven input signals ? high output current (i sc = 80 ma, typ) ? low supply current (i d = 0.9 ma, typ) ? 600 output drive capability ? extended operating temperature ranges (?40 to +105 c and ?55 to +125 c) ? typical gain bandwidth product = 2.2 mhz ? ncv prefix for automotive and other applications requiring unique site and control change requirements; aec?q100 qualified and ppap capable ? these are pb?free devices see detailed ordering and shipping information in the package dimensions section on page 10 of this data sheet. ordering information pdip?8 p, vp suffix case 626 8 1 soic?8 d, vd suffix case 751 pdip?14 p, vp suffix case 646 14 1 soic?14 d, vd suffix case 751a 14 1 tssop?14 dtb suffix case 948g 14 1 micro8 dm suffix case 846a 8 1 see general marking information in the device marking section on page 11 of this data sheet. device marking information http://onsemi.com http://onsemi.com 1 8
mc33201, mc33202, mc33204, ncv33202, ncv33204 http://onsemi.com 2 pin connections 6 7 8 5 3 2 1 4 nc inputs v ee nc v cc nc output (top view) mc33201 all case styles mc33202 all case styles output 1 inputs 1 v ee v cc output 2 inputs 2 1 2 6 7 8 5 3 2 1 4 (top view) mc33204 all case styles (top view) output 1 inputs 1 v cc output 4 inputs 4 1 12 13 14 11 3 2 1 4 10 5 9 6 output 2 8 7 inputs 2 2 4 3 v ee inputs 3 output 3 v in- v out figure 1. circuit schematic (each amplifier) v ee v cc v cc v cc v cc v in+ v ee this device contains 70 active transistors (each amplifier).
mc33201, mc33202, mc33204, ncv33202, ncv33204 http://onsemi.com 3 maximum ratings rating symbol value unit supply voltage (v cc to v ee ) v s +13 v input differential voltage range v idr note 1 v common mode input voltage range (note 2) v cm v cc + 0.5 v to v ee ? 0.5 v v output short circuit duration t s note 3 sec maximum junction temperature t j +150 c storage temperature t stg ? 65 to +150 c maximum power dissipation p d note 3 mw dc electrical characteristics (t a = 25 c) characteristic v cc = 2.0 v v cc = 3.3 v v cc = 5.0 v unit input offset voltage v io (max) mc33201 mc33202, ncv33202 mc33204, ncv33204 8.0 10 12 8.0 10 12 6.0 8.0 10 mv output voltage swing v oh (r l = 10 k ) v ol (r l = 10 k ) 1.9 0.10 3.15 0.15 4.85 0.15 v min v max power supply current per amplifier (i d ) 1.125 1.125 1.125 ma specifications at v cc = 3.3 v are guaranteed by the 2.0 v and 5.0 v tests. v ee = gnd. dc electrical characteristics (v cc = + 5.0 v, v ee = ground, t a = 25 c, unless otherwise noted.) characteristic figure symbol min typ max unit input offset voltage (v cm 0 v to 0.5 v, v cm 1.0 v to 5.0 v) mc33201: t a = + 25 c mc33201: t a = ? 40 to +105 c mc33201v: t a = ? 55 to +125 c mc33202/ncv33202: t a = + 25 c mc33202/ncv33202: t a = ? 40 to +105 c mc33202v: t a = ? 55 to +125 c ncv33202v: t a = ? 55 to +125 c (note 4) mc33204: t a = + 25 c mc33204: t a = ? 40 to +105 c mc33204v: t a = ? 55 to +125 c ncv33204: t a = ? 55 to +125 c 3 ? v io ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? 6.0 9.0 13 8.0 11 14 14 10 13 17 17 mv input offset voltage temperature coefficient (r s = 50 ) t a = ? 40 to +105 c t a = ? 55 to +125 c 4 v io / t ? ? 2.0 2.0 ? ? v/ c input bias current (v cm = 0 v to 0.5 v, v cm = 1.0 v to 5.0 v) t a = + 25 c t a = ? 40 to +105 c t a = ? 55 to +125 c 5, 6 ? i ib ? ? ? ? 80 100 ? 200 250 500 na stresses exceeding maximum ratings may damage the device. maximum ratings are stress ratings only. functional operation above t he recommended operating conditions is not implied. extended exposure to stresses above the recommended operating conditions may af fect device reliability. 1. the differential input voltage of each amplifier is limited by two internal parallel back?to?back diodes. for additional diff erential input voltage range, use current limiting resistors in series with the input pins. 2. the input common mode voltage range is limited by internal diodes connected from the inputs to both supply rails. therefore, the voltage on either input must not exceed either supply rail by more than 500 mv. 3. power dissipation must be considered to ensure maximum junction temperature (t j ) is not exceeded. (see figure 2) 4. all ncv devices are qualified for automotive use.
mc33201, mc33202, mc33204, ncv33202, ncv33204 http://onsemi.com 4 dc electrical characteristics (cont.) (v cc = + 5.0 v, v ee = ground, t a = 25 c, unless otherwise noted.) characteristic figure symbol min typ max unit input offset current (v cm = 0 v to 0.5 v, v cm = 1.0 v to 5.0 v) t a = + 25 c t a = ? 40 to +105 c t a = ? 55 to +125 c ? ? i io ? ? ? ? 5.0 10 ? 50 100 200 na common mode input voltage range ? v icr v ee ? v cc v large signal voltage gain (v cc = + 5.0 v, v ee = ? 5.0 v) r l = 10 k r l = 600 7 a vol 50 25 300 250 ? ? kv/v output voltage swing (v id = 0.2 v) r l = 10 k r l = 10 k r l = 600 r l = 600 8, 9, 10 v oh v ol v oh v ol 4.85 ? 4.75 ? 4.95 0.05 4.85 0.15 ? 0.15 ? 0.25 v common mode rejection (v in = 0 v to 5.0 v) 11 cmr 60 90 ? db power supply rejection ratio v cc /v ee = 5.0 v/gnd to 3.0 v/gnd 12 psrr 500 25 ? v/v output short circuit current (source and sink) 13, 14 i sc 50 80 ? ma power supply current per amplifier (v o = 0 v) t a = ? 40 to +105 c t a = ? 55 to +125 c 15 i d ? ? 0.9 0.9 1.125 1.125 ma ac electrical characteristics (v cc = + 5.0 v, v ee = ground, t a = 25 c, unless otherwise noted.) characteristic figure symbol min typ max unit slew rate (v s = 2.5 v, v o = ? 2.0 v to + 2.0 v, r l = 2.0 k , a v = +1.0) 16, 26 sr 0.5 1.0 ? v/ s gain bandwidth product (f = 100 khz) 17 gbw ? 2.2 ? mhz gain margin (r l = 600 , c l = 0 pf) 20, 21, 22 a m ? 12 ? db phase margin (r l = 600 , c l = 0 pf) 20, 21, 22 m ? 65 ? deg channel separation (f = 1.0 hz to 20 khz, a v = 100) 23 cs ? 90 ? db power bandwidth (v o = 4.0 v pp , r l = 600 , thd 1 %) bw p ? 28 ? khz total harmonic distortion (r l = 600 , v o = 1.0 v pp , a v = 1.0) f = 1.0 khz f = 10 khz 24 thd ? ? 0.002 0.008 ? ? % open loop output impedance (v o = 0 v, f = 2.0 mhz, a v = 10) ? z o ? ? 100 ? differential input resistance (v cm = 0 v) r in ? 200 ? k differential input capacitance (v cm = 0 v) c in ? 8.0 ? pf equivalent input noise voltage (r s = 100 ) f = 10 hz f = 1.0 khz 25 e n ? ? 25 20 ? ? hz nv/ equivalent input noise current f = 10 hz f = 1.0 khz 25 i n ? ? 0.8 0.2 ? ? pa/ hz
mc33201, mc33202, mc33204, ncv33202, ncv33204 http://onsemi.com 5 300 260 220 180 t a , ambient temperature ( c) 100 140 percentage of amplifiers (%) tc v io , input offset voltage temperature coefficient ( v/ c) 50 30 0 40 10 20 a vol , open loop voltage gain (kv/v) figure 2. maximum power dissipation versus temperature figure 3. input offset voltage distribution percentage of amplifiers (%) 40 35 v io , input offset voltage (mv) 30 25 15 0 20 figure 4. input offset voltage temperature coefficient distribution 2500 2000 1000 500 0 t a , ambient temperature ( c) figure 5. input bias current versus temperature figure 6. input bias current versus common mode voltage figure 7. open loop voltage gain versus temperature 150 50 0 -50 v cm , input common mode voltage (v) 1500 p d(max) , maximum power dissipation (m w 200 160 120 80 t a , ambient temperature ( c) 0 i ib , input bias current (na) 40 5.0 10 v cc = +5.0 v v ee = gnd v cm > 1.0 v v cm = 0 v to 0.5 v i ib , input bias current (na) 100 -100 -150 -200 -250 -55 -40 -25 0 25 70 85 125 -50 0 20 40 50 -10 10 30 -30 -40 -20 -10 0 4.0 8.0 10 -55 -40 -25 0 25 50 85 125 2.0 4.0 -2.0 2.0 6.0 -6.0 -8.0 -4.0 -55 -40 -25 0 25 70 85 125 0 6.0 8.0 10 12 105 8 and 14 pin dip pkg so-14 pkg soic-8 pkg 360 amplifiers tested from 3 (mc33204) wafer lots v cc = +5.0 v v ee = gnd t a = 25 c dip package 360 amplifiers tested from 3 (mc33204) wafer lots v cc = +5.0 v v ee = gnd t a = 25 c dip package v cc = +5.0 v v ee = gnd r l = 600 v o = 0.5 v to 4.5 v v cc = 12 v v ee = gnd t a = 25 c tssop-14 pkg
mc33201, mc33202, mc33204, ncv33202, ncv33204 http://onsemi.com 6 v o , output voltage (v ) pp v o , output voltage (v ) pp 40 20 100 80 60 ? v out ? , output voltage (v) 0 f, frequency (hz) 12 0 9.0 3.0 6.0 v cc = +6.0 v v ee = -6.0 v r l = 600 a v = +1.0 t a = 25 c figure 8. output voltage swing versus supply voltage figure 9. output saturation voltage versus load current v i l , load current (ma) v ee figure 10. output voltage versus frequency 12 10 6.0 2.0 0 v cc , ? v ee ? supply voltage (v) figure 11. common mode rejection versus frequency figure 12. power supply rejection versus frequency figure 13. output short circuit current versus output voltage 120 80 60 f, frequency (hz) 8.0 100 80 60 40 f, frequency (hz) 0 cmr, common mode rejection (db) 20 v cc = +6.0 v v ee = -6.0 v t a = -55 to +125 c psr, power supply rejection (db) 100 40 20 0 v cc = +6.0 v v ee = -6.0 v t a = -55 to +125 c v cc = +6.0 v v ee = -6.0 v t a = 25 c 4.0 sat , output saturation voltage (v) t a = 25 c t a = -55 c psr+ psr- i sc , output short circuit current (ma) source sink v cc = +5.0 v v ee = -5.0 v t a = 125 c t a = 125 c t a = -55 c t a = 25 c 10 100 1.0 k 10 k 100 k 1.0 m 0 1.0 2.0 3.0 4.0 5.0 6.0 1.0 k 100 k 1.0 m 10 k 01520 1.0 2.0 10 5.0 10 100 1.0 k 10 k 100 k 1.0 m 3.0 4.0 5.0 6.0 r l = 600 t a = 25 c v cc v cc - 0.2 v v cc - 0.4 v v ee + 0.4 v v ee + 0.2 v
mc33201, mc33202, mc33204, ncv33202, ncv33204 http://onsemi.com 7 , excess phase (degrees) v cc , ? v ee ? , supply voltage (v) i sc , output short circuit current (ma) sr, slew rate (v/ s) t a , ambient temperature ( c) v cc = +2.5 v v ee = -2.5 v v o = 2.0 v figure 14. output short circuit current versus temperature figure 15. supply current per amplifier versus supply voltage with no load i figure 16. slew rate versus temperature t a , ambient temperature ( c) figure 17. gain bandwidth product versus temperature figure 18. voltage gain and phase versus frequency figure 19. voltage gain and phase versus frequency f, frequency (hz) gbw, gain bandwidth product (mhz) a , open loop voltage gain (db) v cc = +5.0 v v ee = gnd cc , supply current per amplifier (ma) t a = 125 c t a = -55 c source sink t a = 25 c +slew rate -slew rate t a , ambient temperature ( c) v cc = +2.5 v v ee = -2.5 v f = 100 khz vol , excess phase (degrees) f, frequency (hz) 70 50 30 10 -10 -30 2.0 0 1.5 0.5 1.0 2.0 1.6 0 150 125 75 25 0 70 50 30 100 4.0 3.0 2.0 0 1.0 10 -10 -30 50 1.2 0.8 0.4 1.0 2.0 3.0 4.0 5.0 6.0 10 k 100 k 1.0 m 10 m -55 -40 -25 25 70 125 0 85 105 0 -55 -40 -25 25 70 125 0 85 105 -55 -40 -25 25 70 125 0 85 105 10 k 100 k 1.0 m 10 m 240 40 80 120 160 200 40 80 120 160 200 240 a , open loop voltage gain (db) vol 1a - phase, c l = 0 pf 1b - gain, c l = 0 pf 2a - phase, c l = 300 pf 2b - gain, c l = 300 pf 1a - phase, v s = 6.0 v 1b - gain, v s = 6.0 v 2a - phase, v s = 1.0 v 2b - gain, v s = 1.0 v v s = 6.0 v t a = 25 c r l = 600 c l = 0 pf t a = 25 c r l = 600 1a 2a 2b 1b 1a 2a 2b 1b
mc33201, mc33202, mc33204, ncv33202, ncv33204 http://onsemi.com 8 m , phase margin (degrees) i , input referred noise current (pa/ hz) n 50 40 30 e , equivalent input noise voltage (nv/ hz) 20 10 0 n r t , differential source resistance ( ) c l , capacitive load (pf) 80 0 70 40 figure 20. gain and phase margin versus temperature figure 21. gain and phase margin versus differential source resistance 75 60 0 figure 22. gain and phase margin versus capacitive load 70 60 40 10 0 t a , ambient temperature ( c) figure 23. channel separation versus frequency figure 24. total harmonic distortion versus frequency figure 25. equivalent input noise voltage and current versus frequency 10 1.0 0.1 f, frequency (hz) 50 150 90 60 0 cs, channel separation (db) 30 thd, total harmonic distortion (%) 0.01 0.001 20 45 30 15 phase margin gain margin f, frequency (hz) f, frequency (hz) m , phase margin (degrees) 30 a m , gain margin (db) a m , gain margin (db) 60 10 20 30 50 a m , gain margin (db) a v = 10 120 a v = 100 a v = 10 a v = 1.0 a v = 100 m , phase margin (degrees) 100 1.0 k 10 k 100 k 10 100 1.0 k 100 k -55 -40 -25 25 70 125 0 85 105 10 10 100 1.0 k 100 1.0 k 10 k 10 100 10 k 100 k 10 k 1.0 k 5.0 4.0 3.0 2.0 1.0 0 70 60 40 10 0 50 20 30 75 60 0 45 30 15 16 0 14 8.0 12 2.0 4.0 6.0 10 v cc = +6.0 v v ee = -6.0 v r l = 600 c l = 100 pf v cc = +6.0 v v ee = -6.0 v t a = 25 c phase margin phase margin gain margin v cc = +6.0 v v ee = -6.0 v r l = 600 a v = 100 t a = 25 c gain margin v cc = +6.0 v v ee = -6.0 v v o = 8.0 v pp t a = 25 c v cc = +5.0 v t a = 25 c v o = 2.0 v pp v ee = -5.0 v r l = 600 v cc = +6.0 v v ee = -6.0 v t a = 25 c noise voltage noise current a v = 1000
mc33201, mc33202, mc33204, ncv33202, ncv33204 http://onsemi.com 9 detailed operating description general information the mc33201/2/4 family of operational amplifiers are unique in their ability to swing rail?to?rail on both the input and the output with a completely bipolar design. this offers low noise, high output current capability and a wide common mode input voltage range even with low supply voltages. operation is guaranteed over an extended temperature range and at supply voltages of 2.0 v, 3.3 v and 5.0 v and ground. since the common mode input voltage range extends from v cc to v ee , it can be operated with either single or split voltage supplies. the mc33201/2/4 are guaranteed not to latch or phase reverse over the entire common mode range, however, the inputs should not be allowed to exceed maximum ratings. circuit information rail?to?rail performance is achieved at the input of the amplifiers by using parallel npn?pnp differential input stages. when the inputs are within 800 mv of the negative rail, the pnp stage is on. when the inputs are more than 800 mv greater than v ee , the npn stage is on. this switching of input pairs will cause a reversal of input bias currents (see figure 6). also, slight differences in offset voltage may be noted between the npn and pnp pairs. cross?coupling techniques have been used to keep this change to a minimum. in addition to its rail?to?rail performance, the output stage is current boosted to provide 80 ma of output current, enabling the op amp to drive 600 loads. because of this high output current capability, care should be taken not to exceed the 150 c maximum junction temperature. o , output voltage (50 mv/div) v t, time (10 s/div) figure 26. noninverting amplifier slew rate figure 27. small signal transient response t, time (5.0 s/div) figure 28. large signal transient response v cc = +6.0 v v ee = -6.0 v r l = 600 c l = 100 pf t a = 25 c o , output voltage (2.0 mv/div) v cc = +6.0 v v ee = -6.0 v r l = 600 c l = 100 pf a v = 1.0 t a = 25 c v v cc = +6.0 v v ee = -6.0 v r l = 600 c l = 100 pf t a = 25 c t, time (10 s/div) o , output voltage (2.0 v/div) v surface mount board layout is a critical portion of the total design. the footprint for the semiconductor packages must be the correct size to ensure proper solder connection interface between the board and the package. with the correct pad geometry, the packages will self?align when subjected to a solder reflow process.
mc33201, mc33202, mc33204, ncv33202, ncv33204 http://onsemi.com 10 ordering information operational amplifier function device operating temperature range package shipping ? single mc33201dg t a = ?40 to +105 c soic?8 (pb?free) 98 units / rail mc33201dr2g 2500 / tape & reel mc33201pg pdip?8 (pb?free) 50 units / rail MC33201VDR2G soic?8 (pb?free) 2500 / tape & reel mc33201vdg t a = ?55 to 125 c soic?8 (pb?free) 98 units / rail dual mc33202dg t a = ?40 to +105 c soic?8 (pb?free) 98 units / rail mc33202dr2g 2500 / tape & reel mc33202dmr2g micro?8 (pb?free) 4000 / tape & reel ncv33202dmr2g* mc33202pg pdip?8 (pb?free) 50 units / rail mc33202vdg t a = ?55 to 125 c soic?8 (pb?free) 98 units / rail mc33202vdr2g soic?8 (pb?free) 2500 / tape & reel ncv33202vdr2g* mc33202vpg pdip?8 (pb?free) 50 units / rail quad mc33204dg t a = ?40 to +105 c so?14 (pb?free) 55 units / rail mc33204dr2g 2500 units / tape & reel mc33204dtbg tssop?14 (pb?free) 96 units / rail mc33204dtbr2g 2500 units / tape & reel mc33204pg pdip?14 (pb?free) 25 units / rail mc33204vdg t a = ?55 to 125 c so?14 (pb?free) 55 units / rail mc33204vdr2g so?14 (pb?free) 2500 units / tape & reel ncv33204dr2g* ncv33204dtbr2g* tssop?14 (pb?free) 2500 units / tape & reel mc33204vpg pdip?14 (pb?free) 25 units / rail ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specifications brochure, brd8011/d. *ncv prefix for automotive and other applications requiring unique site and control change requirements; aec?q100 qualified and ppap capable.
mc33201, mc33202, mc33204, ncv33202, ncv33204 http://onsemi.com 11 soic?8 d suffix case 751 pdip?8 p suffix case 626 soic?8 vd suffix case 751 x = 1 or 2 a = assembly location wl, l = wafer lot yy, y = year ww, w = work week g = pb?free package = pb?free package (note: microdot may be in either location) pdip?8 vp suffix case 626 so?14 d suffix case 751a tssop?14 dtb suffix case 948g pdip?14 p suffix case 646 so?14 vd suffix case 751a pdip?14 vp suffix case 646 marking diagrams micro?8 dm suffix case 846a 1 8 mc3320xp awl yywwg 1 8 mc33202vp awl yywwg 1 14 mc33204dg awlyww 1 14 mc33204vdg awlyww 1 14 mc33204p awlyywwg 1 14 mc33204vp awlyywwg 1 14 mc33 204 alyw * *this marking diagram applies to ncv3320xv **this marking diagram applies to ncv33202dmr2g * * 3320x alyw 1 8 320xv alyw 1 8 3202 ayw 1 8 1 14 mc33 204v alyw **
mc33201, mc33202, mc33204, ncv33202, ncv33204 http://onsemi.com 12 package dimensions pdip?8 p, vp suffix case 626?05 issue n 14 5 8 b2 note 8 d b l a1 a eb e a top view c seating plane 0.010 ca side view end view end view with leads constrained dim min max inches a ???? 0.210 a1 0.015 ???? b 0.014 0.022 c 0.008 0.014 d 0.355 0.400 d1 0.005 ???? e 0.100 bsc e 0.300 0.325 m ???? 10 ??? 5.33 0.38 ??? 0.35 0.56 0.20 0.36 9.02 10.16 0.13 ??? 2.54 bsc 7.62 8.26 ??? 10 min max millimeters notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: inches. 3. dimensions a, a1 and l are measured with the pack- age seated in jedec seating plane gauge gs?3. 4. dimensions d, d1 and e1 do not include mold flash or protrusions. mold flash or protrusions are not to exceed 0.10 inch. 5. dimension e is measured at a point 0.015 below datum plane h with the leads constrained perpendicular to datum c. 6. dimension e3 is measured at the lead tips with the leads unconstrained. 7. datum plane h is coincident with the bottom of the leads, where the leads exit the body. 8. package contour is optional (rounded or square corners). e1 0.240 0.280 6.10 7.11 b2 eb ???? 0.430 ??? 10.92 0.060 typ 1.52 typ e1 m 8x c d1 b a2 0.115 0.195 2.92 4.95 l 0.115 0.150 2.92 3.81 h note 5 e e/2 a2 note 3 m b m note 6 m
mc33201, mc33202, mc33204, ncv33202, ncv33204 http://onsemi.com 13 package dimensions soic?8 nb case 751?07 issue ak seating plane 1 4 5 8 n j x 45 k notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimension a and b do not include mold protrusion. 4. maximum mold protrusion 0.15 (0.006) per side. 5. dimension d does not include dambar protrusion. allowable dambar protrusion shall be 0.127 (0.005) total in excess of the d dimension at maximum material condition. 6. 751?01 thru 751?06 are obsolete. new standard is 751?07. a b s d h c 0.10 (0.004) dim a min max min max inches 4.80 5.00 0.189 0.197 millimeters b 3.80 4.00 0.150 0.157 c 1.35 1.75 0.053 0.069 d 0.33 0.51 0.013 0.020 g 1.27 bsc 0.050 bsc h 0.10 0.25 0.004 0.010 j 0.19 0.25 0.007 0.010 k 0.40 1.27 0.016 0.050 m 0 8 0 8 n 0.25 0.50 0.010 0.020 s 5.80 6.20 0.228 0.244 ?x? ?y? g m y m 0.25 (0.010) ?z? y m 0.25 (0.010) z s x s m 1.52 0.060 7.0 0.275 0.6 0.024 1.270 0.050 4.0 0.155 mm inches scale 6:1 *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint*
mc33201, mc33202, mc33204, ncv33202, ncv33204 http://onsemi.com 14 package dimensions micro8 dm suffix case 846a?02 issue h 8x 8x 6x mm inches scale 8:1 1.04 0.041 0.38 0.015 5.28 0.208 4.24 0.167 3.20 0.126 0.65 0.0256 *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* s b m 0.08 (0.003) a s t notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimension a does not include mold flash, protrusions or gate burrs. mold flash, protrusions or gate burrs shall not exceed 0.15 (0.006) per side. 4. dimension b does not include interlead flash or protrusion. interlead flash or protrusion shall not exceed 0.25 (0.010) per side. 5. 846a-01 obsolete, new standard 846a-02. b e pin 1 id 8 pl 0.038 (0.0015) ?t? seating plane a a1 c l dim a min nom max min millimeters ?? ?? 1.10 ?? inches a1 0.05 0.08 0.15 0.002 b 0.25 0.33 0.40 0.010 c 0.13 0.18 0.23 0.005 d 2.90 3.00 3.10 0.114 e 2.90 3.00 3.10 0.114 e 0.65 bsc l 0.40 0.55 0.70 0.016 ?? 0.043 0.003 0.006 0.013 0.016 0.007 0.009 0.118 0.122 0.118 0.122 0.026 bsc 0.021 0.028 nom max 4.75 4.90 5.05 0.187 0.193 0.199 h e h e d d e
mc33201, mc33202, mc33204, ncv33202, ncv33204 http://onsemi.com 15 package dimensions pdip?14 case 646?06 issue r 17 14 8 b2 note 8 d a top view e1 b b l a1 a c seating plane 0.010 ca side view m 14x d1 e a2 note 3 m b m eb e end view end view with leads constrained dim min max inches a ???? 0.210 a1 0.015 ???? b 0.014 0.022 c 0.008 0.014 d 0.735 0.775 d1 0.005 ???? e 0.100 bsc e 0.300 0.325 m ???? 10 ??? 5.33 0.38 ??? 0.35 0.56 0.20 0.36 18.67 19.69 0.13 ??? 2.54 bsc 7.62 8.26 ??? 10 min max millimeters notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: inches. 3. dimensions a, a1 and l are measured with the pack- age seated in jedec seating plane gauge gs?3. 4. dimensions d, d1 and e1 do not include mold flash or protrusions. mold flash or protrusions are not to exceed 0.10 inch. 5. dimension e is measured at a point 0.015 below datum plane h with the leads constrained perpendicular to datum c. 6. dimension e3 is measured at the lead tips with the leads unconstrained. 7. datum plane h is coincident with the bottom of the leads, where the leads exit the body. 8. package contour is optional (rounded or square corners). e1 0.240 0.280 6.10 7.11 b2 eb ???? 0.430 ??? 10.92 0.060 typ 1.52 typ c a2 0.115 0.195 2.92 4.95 l 0.115 0.150 2.92 3.81 h note 5 note 6 m
mc33201, mc33202, mc33204, ncv33202, ncv33204 http://onsemi.com 16 package dimensions soic?14 case 751a?03 issue k notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. dimension b does not include dambar protrusion. allowable protrusion shall be 0.13 total in excess of at maximum material condition. 4. dimensions d and e do not include mold protrusions. 5. maximum mold protrusion 0.15 per side. h 14 8 7 1 m 0.25 b m c h x 45 seating plane a1 a m s a m 0.25 b s c b 13x b a e d e detail a l a3 detail a dim min max min max inches millimeters d 8.55 8.75 0.337 0.344 e 3.80 4.00 0.150 0.157 a 1.35 1.75 0.054 0.068 b 0.35 0.49 0.014 0.019 l 0.40 1.25 0.016 0.049 e 1.27 bsc 0.050 bsc a3 0.19 0.25 0.008 0.010 a1 0.10 0.25 0.004 0.010 m 0 7 0 7 h 5.80 6.20 0.228 0.244 h 0.25 0.50 0.010 0.019 6.50 14x 0.58 14x 1.18 1.27 dimensions: millimeters 1 pitch soldering footprint* *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d.
mc33201, mc33202, mc33204, ncv33202, ncv33204 http://onsemi.com 17 package dimensions tssop?14 case 948g issue b dim min max min max inches millimeters a 4.90 5.10 0.193 0.200 b 4.30 4.50 0.169 0.177 c ??? 1.20 ??? 0.047 d 0.05 0.15 0.002 0.006 f 0.50 0.75 0.020 0.030 g 0.65 bsc 0.026 bsc h 0.50 0.60 0.020 0.024 j 0.09 0.20 0.004 0.008 j1 0.09 0.16 0.004 0.006 k 0.19 0.30 0.007 0.012 k1 0.19 0.25 0.007 0.010 l 6.40 bsc 0.252 bsc m 0 8 0 8 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimension a does not include mold flash, protrusions or gate burrs. mold flash or gate burrs shall not exceed 0.15 (0.006) per side. 4. dimension b does not include interlead flash or protrusion. interlead flash or protrusion shall not exceed 0.25 (0.010) per side. 5. dimension k does not include dambar protrusion. allowable dambar protrusion shall be 0.08 (0.003) total in excess of the k dimension at maximum material condition. 6. terminal numbers are shown for reference only. 7. dimension a and b are to be determined at datum plane ?w?. s u 0.15 (0.006) t 2x l/2 s u m 0.10 (0.004) v s t l ?u? seating plane 0.10 (0.004) ?t? ??? ??? ??? 0.25 (0.010) 8 14 7 1 pin 1 ident. h g a d c b s u 0.15 (0.006) t ?v? 14x ref k n n 7.06 14x 0.36 14x 1.26 0.65 dimensions: millimeters 1 pitch soldering footprint on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its of ficers, employees, subsidiaries, af filiates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. p ublication ordering information n. american technical support : 800?282?9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81?3?5817?1050 mc33201/d micro8 is a trademark of international rectifier. literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303?675?2175 or 800?344?3860 toll free usa/canada fax : 303?675?2176 or 800?344?3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your loc al sales representative

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